Intel’s 18A node enters danger manufacturing, paving the best way for Panther Lake

The large image: 2025 is shaping as much as be a pivotal 12 months for Intel’s comeback technique. With a brand new CEO on the helm, the corporate is positioning its next-generation {hardware} as a litmus check for its return to the forefront of semiconductor manufacturing. As Intel’s manufacturing roadmap reaches a vital juncture, how potential purchasers will reply stays unsure.

Kevin O’Buckley, senior vice chairman and normal supervisor of Intel Foundry Providers, confirmed that danger manufacturing has begun for the corporate’s upcoming 18A semiconductor node. The announcement, made at Intel’s Imaginative and prescient convention, is more likely to reassure traders and purchasers that improvement of the subsequent technology of laptop computer and server processors has entered a vital section.

Threat manufacturing, an industry-standard time period, refers back to the stage the place producers refine the manufacturing course of for brand new chips. O’Buckley defined that Intel is at the moment scaling up from producing a whole bunch of 18A wafers at a time to 1000’s.

Additionally see: How CPUs are Designed, Half 3:
Constructing the Chip

Though Intel has not but named any exterior purchasers dedicated to constructing industrial chips on 18A, the corporate goals to succeed in quantity and mass manufacturing in time to launch its Panther Lake CPUs later this 12 months. With 28A tape-out design finalizations set to start within the first half of 2025, Panther Lake is predicted to ship important enhancements in AI efficiency over Intel’s Core Extremely 200V pocket book processors.

Intel’s new CEO, Lip-Bu Tan, additionally just lately confirmed that Nova Lake and Clearwater Forest chips are scheduled for launch in 2026. Nova Lake will incorporate silicon from TSMC, Intel’s foundry rival, whereas Clearwater Forest will convey 18A to the server market.

With 18A, Intel is racing to outpace TSMC in bringing sub-3nm applied sciences to market – particularly gate-all-around (GAA) transistors and bottom energy supply. These improvements enhance efficiency by lowering energy leakage and enabling greater transistor density. TSMC doesn’t plan to introduce GAA and bottom energy supply till its N2 and A16 nodes debut subsequent 12 months. N2 is predicted to enter early manufacturing quickly and ramp as much as mass manufacturing later this 12 months.

Intel’s manufacturing has trailed behind TSMC and Samsung for a number of years. Following a string of disappointing quarters that led to the departure of former CEO Pat Gelsinger, the 18A node is seen as a vital alternative to reestablish confidence in Intel’s foundry enterprise.

Nvidia and Broadcom are reportedly exploring the use of 18A for future merchandise, although they’re nonetheless within the early testing section with Intel’s wafers. In the meantime, Apple is predicted to be the primary to undertake TSMC’s N2 node, probably debuting it within the A20 processor for the iPhone 18 Professional in late 2026. AMD, Broadcom, Amazon AWS, and Intel are additionally anticipated to make use of N2.

Nvidia and Broadcom are reportedly thinking about utilizing 18A for future merchandise, however the two firms are probably simply working early exams with Intel’s wafers. In the meantime, Apple is first in line for TSMC’s N2, which can probably debut with the iPhone 18 Professional’s A20 processor in late 2026. AMD, Broadcom, Amazon AWS, and Intel are additionally anticipated to make use of N2.